정밀 가공 회사인 Wilting은 반도체 자본 설비를 생산하는 대형 제조사들이 복잡한 금속 부품을 생산하여 시스템 영상 정확도와 생산성을 개선할 수 있도록 지원합니다. 적층 제조 분야의 리더인 3D Systems는 대형 반도체 OEM을 비롯한 공급업체와 10년 넘게 파트너십을 체결하여 원형 제작 단계에서 생산 단계로 확장할 수 있도록 지원하고 있습니다. Wilting은 3D Systems와 협력하여 첨단 금속 적층 제조 기술을 빠르게 도입한 끝에 이제는 반도체 자본 설비의 성능 개선을 고려해 최적화된 구성품을 설계하여 생산할 수 있게 되었습니다. 

도전 과제

분해능을 높이기 위한 경쟁의 선두주자

Semiconductor OEMs are under pressure to advance lithography capabilities as microchip package sizes continue to decrease. Working with 3D Systems’ Application Innovation Group and metal additive manufacturing solutions, semiconductor OEMs and tier 1 suppliers like Wilting are reaping the benefits of optimized semiconductor components in the race to higher resolution with application-specific consultation on design for optimized performance and manufacturability. 

Metal additive manufacturing allows for the design and manufacturing of highly optimized components. When applied to semiconductor lithography and wafer processing equipment, complex metal AM parts like manifolds, wafer tables, wafer handling systems, flexures, and brackets improve performance and reliability of the part. These improvements enable system accuracy advancements at the nanometer level, and improved speed and throughput that ultimately results in more wafers processed and improved total cost of ownership. 

우리는 3D Systems의 기술 이전과 컨설팅 서비스 덕분에 고객이 설계 및 엔지니어링 과제를 해결하도록 지원할 수 있게 되었습니다. 또한 고객이 아이디어를 프린트가 가능한 수준으로 구체화하여 적층 제조의 이점을 원하는 응용 분야에 적용하는 데도 더욱 큰 도움을 제공할 수 있습니다.  

- Adwin Kannekens, Wilting의 영업 이사

 

솔루션

확장 가능한 생산을 위한 협업

01 Application Engineering Consultation

Together with Wilting and 3D Systems, semiconductor OEMs are able to make many design and performance improvements in an accelerated timeframe by leveraging AM design guidance from 3D Systems’ application engineers and Wilting’s precision production. It is now possible to rapidly iterate and test complex semiconductor components with a proven path to production.  

For example, manifolds designed for additive manufacturing like the part pictured here, optimize fluid and gas flow to reduce pressure drops and minimize mechanical disturbances and vibration. Traditional manufacturing often results in parts that are large, heavy, and cause stagnant flow and unreliable connections that negatively affect system performance. The benefits of using additive manufacturing for semiconductor applications include: 3d-systems-dmp-laserform-Ti-gr5-(A)-hydraulic manifold-GF post-machined-2019-07-07-a23

  • Optimized fluid flow. It is possible to reduce liquid induced disturbance forces by as much as 90% with AM solutions. 

  • Reduced weight and volume. Additive manufacturing light-weighting can reduce weight as much as 50%, as well as optimize volume claims in limited spaces versus conventional manufacturing. 

  • Increased reliability. Compared to a traditionally manufactured manifold assembly (20+ parts), additive manufacturing can deliver a single monolithic part for increased reliability, and improved manufacturing and yield. 

결과

Production support via 3D Systems’ Customer Innovation Center provides high quality, high accuracy additive manufacturing services paired with proprietary processes for optimal particle cleanliness. This service delivers metal parts that meet clean room requirements and are fit for use in lithography and wafer processing equipment. 

Wilting has been able to build up its expertise over time in post-machining, post-processing, and assemblingDMP Manifold 3D printed parts by partnering with 3D Systems. As this partnership has continued, it has also proved the demand for additive manufacturing with Wilting’s customer base. 

Even with an AM system in-house, Wilting anticipates that demand for metal printed parts will be quick to exceed in-house capacity. “Our relationship with 3D Systems will continue in developing new business effective immediately, because 3D Systems extends our capacity with overflow production support as business grows,” said Kannekens. 

03 Metal Additive Capabilities

After building demand for complex AM parts among its customers, Wilting selected 3D Systems' DMP Flex 350 for high quality in-house metal printing. The best-in-class oxygen level (<25 ppm) and inert atmosphere of 3D Systems’ metal AM technology ensures exceptionally strong and accurate parts of high chemical purity in titanium, stainless steel, aluminum, or nickel alloy.  

The DMP Flex 350 is an integrated metal AM solution that combines a high throughput, modular printer architecture with 3DXpert® all-in-one 3D printing software and a suite of extensively tested LaserForm® materials. Wilting can grow capacity with the DMP Flex 350 by adding additional printers when ready.

04 Technology Transfer

Through technology transfer, 3D Systems engineers share knowledge and provide training to new printer customers to streamline and accelerate their transition to AM and safeguard their investment. This leverages pre-developed print files and processes and includes professional account management, consulting, training across pre-qualified AM production processes, and installation. For Wilting, technology transfer has focused on printing processes and strategies like how to run the machine, program the printer, set up files for printing, part supports and orientation, and part post-processing, among other specialized tasks. 

3D Systems’ technology transfer helps 3D Systems’ customers mitigate the risks inherent to change and experience AM productivity right away, with faster time to market.

The Results

HIGHER PERFORMANCE AND PRODUCTIVITY IN SEMICONDUCTOR CAPITAL EQUIPMENT

  • Productivity improvements

    Reduce inertia and system vibration with up to 50% lighter parts for increased machine speed and up-time resulting in more wafers processed.

    Performance improvements

    90% reduction in flow induced disturbance forces reduce system vibration and realize a 1-2 nm accuracy improvement.

    Reduced cost of AM adoption

    through expert-led technology transfer to accelerate learning and time-to-market. 

     

  • Design flexibility

    Optimally design, rapidly iterate, and manufacture manifolds with complex freeform channels that reduce disturbance forces.

    Reliability

    Replace multi-part assemblies with monolithic parts for increased reliability, as well as improved manufacturing yield and reduced labor costs.